热 - 散热器
- 品牌：
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- Aavid (1)
- CTS Corporation (229)
- CUI Devices (120)
- iWave Systems (3)
- Malico Inc. (21)
- Ohmite (58)
- Seeed (3)
- Wakefield Thermal (91)
- Attachment Method：
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- Material Finish：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Product Status：
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- Shape：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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596 条记录
| 图片 | 型号 | 品牌 | 描述 | 库存 | 操作 | |
|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, STAMPI... |
2,500
In-stock
|
提交询价 | ||
|
|
NTE Electronics, Inc. | HEATSINK FOR PLA... |
1,312
In-stock
|
提交询价 | ||
|
|
ASSMANN WSW Components | CPU HEATSINK, CRO... |
2,562
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
2,992
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
2,215
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
4,828
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, BGA, 33.... |
1,194
In-stock
|
提交询价 | ||
|
|
NTE Electronics, Inc. | HEAT SINK-PLAST. ... |
172
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
1,606
In-stock
|
提交询价 | ||
|
|
ASSMANN WSW Components | CPU HEATSINK, CRO... |
1,334
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
1,977
In-stock
|
提交询价 | ||
|
|
NTE Electronics, Inc. | HEATSINK FOR TO-2... |
1,448
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, BGA, 28.... |
1,704
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1,577
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, BGA, 23 ... |
1,202
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
3,230
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1,542
In-stock
|
提交询价 | ||
|
|
ASSMANN WSW Components | CPU HEATSINK, CRO... |
1,035
In-stock
|
提交询价 | ||
|
|
ASSMANN WSW Components | CPU HEATSINK, CRO... |
1,315
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1,582
In-stock
|
提交询价 |
