热 - 散热器

Attachment Method:
Package Cooled:
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Natural:
图片 型号 品牌 描述 库存 操作
HSB17-404025 CUI Devices
HEAT SINK, BGA, 40 ...
RFQ
35,000
In-stock
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HSE06-503045 CUI Devices
HEAT SINK, EXTRUS...
RFQ
1,197
In-stock
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HSE07-753045 CUI Devices
HEAT SINK, EXTRUS...
RFQ
992
In-stock
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