热 - 散热器

品牌:
Package Cooled:
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Natural:
图片 型号 品牌 描述 库存 操作
HSB11-252518 CUI Devices
HEAT SINK, BGA, 25 ...
RFQ
1,433
In-stock
提交询价
BGAH190-090E Ohmite
BGA HEATSINK W/TA...
RFQ
221
In-stock
提交询价
HSB19-272718 CUI Devices
HEAT SINK, BGA, 27 ...
RFQ
239
In-stock
提交询价
1 / 1 Page, 3 Records