热 - 散热器

Power Dissipation @ Temperature Rise:
Product Status:
Thermal Resistance @ Forced Air Flow:
Thermal Resistance @ Natural:
596 条记录
图片 型号 品牌 描述 库存 操作
HSE-B20250-045H CUI Devices
HEAT SINK, EXTRUS...
RFQ
14
In-stock
提交询价
HSB21-454515 CUI Devices
HEAT SINK, BGA, 45 ...
RFQ
35,000
In-stock
提交询价
CR101-25AE Ohmite
ALUMINUM HEATSIN...
RFQ
35,000
In-stock
提交询价
CR201-25AE Ohmite
ALUMINUM HEATSIN...
RFQ
35,000
In-stock
提交询价
BGAH170-075E Ohmite
BGA HEATSINK W/TA...
RFQ
35,000
In-stock
提交询价
CR201-75AE Ohmite
ALUMINUM HEATSIN...
RFQ
35,000
In-stock
提交询价
114070162 Seeed
ALUMINUM ALLOY C...
RFQ
1
In-stock
提交询价
CR201-25VE Ohmite
ALUMINUM HEATSIN...
RFQ
35,000
In-stock
提交询价
WAVE-35-12 Wakefield Thermal
ANCHOR HEATSINK ...
RFQ
35,000
In-stock
提交询价
CR101-75VE Ohmite
ALUMINUM HEATSIN...
RFQ
35,000
In-stock
提交询价
CR401-50VE Ohmite
ALUMINUM HEATSIN...
RFQ
5
In-stock
提交询价
BGAH325-075E Ohmite
BGA HEATSINK W/TA...
RFQ
2
In-stock
提交询价
CR401-75VE Ohmite
ALUMINUM HEATSIN...
RFQ
22
In-stock
提交询价
HSF-50-40-Y-F Wakefield Thermal
FANSINK 5VDC 50X50X...
RFQ
5
In-stock
提交询价
HSF-55-45-Y-F Wakefield Thermal
FANSINK 12VDC 55X55...
RFQ
5
In-stock
提交询价
HSB01-080808 CUI Devices
HEAT SINK, BGA, 8.5...
RFQ
35,000
In-stock
提交询价
HSS14-B20-NP CUI Devices
HEAT SINK, STAMPI...
RFQ
35,000
In-stock
提交询价
HSB04-171706 CUI Devices
HEAT SINK, BGA, 17 ...
RFQ
35,000
In-stock
提交询价
HSB07-202009 CUI Devices
HEAT SINK, BGA, 20 ...
RFQ
35,000
In-stock
提交询价
HSE-B20350-NP CUI Devices
HEAT SINK, EXTRUS...
RFQ
35,000
In-stock
提交询价
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