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Environmental
Our electronic chips are fully RoHS‑, REACH‑ and WEEE‑compliant—limiting Pb, Hg, Cd, Cr⁶⁺, PBB and PBDE according to EU Directive 2011/65/EU, screening all substances under EC 1907/2006 for SVHCs, and supporting proper end‑of‑life recycling under 2012/19/EU—while being built with halogen‑free, flame‑retardant materials and shipped in FSC‑certified, recycled or recyclable packaging optimized to reduce weight and emissions.
Through real‑time energy monitoring, high‑efficiency motors and smart temperature controls, we’ve cut production‑line energy use by 10%, and we publicly report our Scope 1–3 carbon footprint, targeting a 30% intensity reduction by 2030. Our modular, snap‑apart chip packages and certified e‑waste take‑back partnerships ensure easy disassembly and material recovery, and our ISO 14001‑certified environmental management system drives continuous improvement and investment in low‑carbon, low‑power semiconductor innovations.









