热 - 散热器

Package Cooled:
Power Dissipation @ Temperature Rise:
Product Status:
Thermal Resistance @ Forced Air Flow:
Thermal Resistance @ Natural:
图片 型号 品牌 描述 库存 操作
HSB25-282810 CUI Devices
HEAT SINK, BGA, 28....
RFQ
1,704
In-stock
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2274283-3 TE Connectivity AMP Connectors
HEATSINK ASSEMBL...
RFQ
25
In-stock
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