热 - 散热器
- 品牌：
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- CUI Devices (1)
- Attachment Method：
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- Material：
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- Material Finish：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Product Status：
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- Thermal Resistance @ Natural：
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| 图片 | 型号 | 品牌 | 描述 | 库存 | 操作 | |
|---|---|---|---|---|---|---|
|
Wakefield Thermal | HEATSINK DPAK SM... |
926
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, BGA, 8.5... |
35,000
In-stock
|
提交询价 | ||
|
|
Wakefield Thermal | BOARD LEVEL HEAT... |
35,000
In-stock
|
提交询价 | ||
|
|
Wakefield Thermal | HEATSINK DPAK SM... |
35,000
In-stock
|
提交询价 |
