热 - 散热器
- 品牌：
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- Aavid (25)
- Cooling Source (54)
- CTS Corporation (153)
- CUI Devices (28)
- DFRobot (1)
- Radian (8)
- Sunon (2)
- T-Global Technology (17)
- Wakefield Thermal (449)
- Attachment Method：
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- Material Finish：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Product Status：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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951 条记录
| 图片 | 型号 | 品牌 | 描述 | 库存 | 操作 | |
|---|---|---|---|---|---|---|
|
Wakefield Thermal | HEATSINK 29X12MM S... |
118
In-stock
|
提交询价 | ||
|
|
Wakefield Thermal | HEATSINK 23X23MM F... |
247
In-stock
|
提交询价 | ||
|
|
Wakefield Thermal | HEATSINK 21X21X12MM... |
391
In-stock
|
提交询价 | ||
|
|
Aavid | HEATSINK TO-3 H31.7... |
359
In-stock
|
提交询价 | ||
|
|
Wakefield Thermal | HEATSINK 27X33MM S... |
190
In-stock
|
提交询价 | ||
|
|
Advanced Thermal Solutions, Inc. | FANSINK ASSEMBLY... |
273
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, BGA,25 X... |
1,358
In-stock
|
提交询价 | ||
|
|
ASSMANN WSW Components | CPU HEATSINK, CRO... |
1,713
In-stock
|
提交询价 | ||
|
|
ASSMANN WSW Components | CPU HEATSINK, CRO... |
2,562
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, BGA, 33.... |
1,194
In-stock
|
提交询价 | ||
|
|
ASSMANN WSW Components | CPU HEATSINK, CRO... |
1,334
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, BGA, 28.... |
1,704
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, BGA, 23 ... |
1,202
In-stock
|
提交询价 | ||
|
|
ASSMANN WSW Components | CPU HEATSINK, CRO... |
1,035
In-stock
|
提交询价 | ||
|
|
ASSMANN WSW Components | CPU HEATSINK, CRO... |
1,315
In-stock
|
提交询价 | ||
|
|
ASSMANN WSW Components | CPU HEATSINK, CRO... |
1,500
In-stock
|
提交询价 | ||
|
|
ASSMANN WSW Components | CPU HEATSINK, CRO... |
1,499
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, BGA, 43.... |
1,081
In-stock
|
提交询价 | ||
|
|
T-Global Technology | ALUMINIUM HEAT S... |
1,000
In-stock
|
提交询价 | ||
|
|
T-Global Technology | ALUMINIUM HEAT S... |
183
In-stock
|
提交询价 |
