热 - 散热器
- 品牌：
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- Aavid (25)
- Cooling Source (54)
- CTS Corporation (153)
- CUI Devices (28)
- DFRobot (1)
- Radian (8)
- Sunon (2)
- T-Global Technology (17)
- Wakefield Thermal (449)
- Attachment Method：
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- Material Finish：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Product Status：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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951 条记录
| 图片 | 型号 | 品牌 | 描述 | 库存 | 操作 | |
|---|---|---|---|---|---|---|
|
ASSMANN WSW Components | HEATSINK CPU XCU... |
1,956
In-stock
|
提交询价 | ||
|
|
ASSMANN WSW Components | CPU HEATSINK, CRO... |
422
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, BGA, 25 ... |
1,433
In-stock
|
提交询价 | ||
|
|
Wakefield Thermal | HEATSINK CPU 28MM... |
6,217
In-stock
|
提交询价 | ||
|
|
Wakefield Thermal | HEATSINK CPU 25MM... |
3,932
In-stock
|
提交询价 | ||
|
|
ASSMANN WSW Components | HEATSINK CPU XCU... |
6,099
In-stock
|
提交询价 | ||
|
|
Wakefield Thermal | HEATSINK CPU 43MM... |
5,291
In-stock
|
提交询价 | ||
|
|
Aavid | HEATSINK BGA W/AD... |
1,015
In-stock
|
提交询价 | ||
|
|
T-Global Technology | ALUMINIUM HEAT S... |
72
In-stock
|
提交询价 | ||
|
|
Wakefield Thermal | HEATSINK CPU 40.6M... |
6,921
In-stock
|
提交询价 | ||
|
|
ASSMANN WSW Components | HEATSINK CPU FOR... |
1,940
In-stock
|
提交询价 | ||
|
|
ASSMANN WSW Components | HEATSINK CPU FOR... |
1,037
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, BGA, 40 ... |
1,250
In-stock
|
提交询价 | ||
|
|
T-Global Technology | ALUMINIUM HEAT S... |
214
In-stock
|
提交询价 | ||
|
|
Wakefield Thermal | HEATSINK CPU 28MM... |
1,090
In-stock
|
提交询价 | ||
|
|
Wakefield Thermal | HEATSINK CPU 28MM... |
2,294
In-stock
|
提交询价 | ||
|
|
ASSMANN WSW Components | HEATSINK CPU FOR... |
1,273
In-stock
|
提交询价 | ||
|
|
Wakefield Thermal | HEATSINK CPU 28MM... |
31,979
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, BGA, 40 ... |
35,000
In-stock
|
提交询价 | ||
|
|
Aavid | HEATSINK BGA W/AD... |
1,296
In-stock
|
提交询价 |
