热 - 散热器
- 品牌:
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- Aavid (13)
- Comair Rotron (3)
- CTS Corporation (2)
- CUI Devices (17)
- DFRobot (3)
- Enclustra (2)
- Sanyo Denki (5)
- Seeed (6)
- T-Global Technology (36)
- TechNexion (1)
- Trenz Electronic (3)
- Attachment Method:
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- Material:
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- Material Finish:
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- Package Cooled:
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- Power Dissipation @ Temperature Rise:
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- Product Status:
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- Thermal Resistance @ Forced Air Flow:
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- Thermal Resistance @ Natural:
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- 已选条件:
104 条记录
图片 | 型号 | 品牌 | 描述 | 库存 | 操作 | |
---|---|---|---|---|---|---|
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T-Global Technology | PH3N NANO 50.8X12.70X... |
298
In-stock
|
提交询价 | ||
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Enclustra | ACC HEATSINK ME A... |
14
In-stock
|
提交询价 | ||
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DFRobot | RASPBERRY PI COP... |
35,000
In-stock
|
提交询价 | ||
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Seeed | RASPBERRY PI COO... |
3
In-stock
|
提交询价 | ||
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Trenz Electronic | HEATSPREADER FOR... |
3
In-stock
|
提交询价 | ||
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T-Global Technology | CERAMIC HEAT SPR... |
54
In-stock
|
提交询价 | ||
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T-Global Technology | CERAMIC HEAT SPR... |
33
In-stock
|
提交询价 | ||
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CUI Devices | HEAT SINK, STAMPI... |
35,000
In-stock
|
提交询价 | ||
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NTE Electronics, Inc. | HEAT SINK FOR TO2... |
35,000
In-stock
|
提交询价 | ||
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Wakefield Thermal | HEATSINK TO-220 |
35,000
In-stock
|
提交询价 | ||
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Wakefield Thermal | HEATSINK TO-221 |
35,000
In-stock
|
提交询价 | ||
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Wakefield Thermal | HEATSINK FOR TO92 |
35,000
In-stock
|
提交询价 | ||
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CUI Devices | HEAT SINK, EXTRUS... |
35,000
In-stock
|
提交询价 | ||
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CUI Devices | HEAT SINK, STAMPI... |
35,000
In-stock
|
提交询价 | ||
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T-Global Technology | PH3N NANO 101.6X38.1X... |
9
In-stock
|
提交询价 | ||
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Aavid | HEATSINK TO-202 CL... |
35,000
In-stock
|
提交询价 | ||
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Aavid | HEATSINK TO-202 CL... |
35,000
In-stock
|
提交询价 | ||
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Aavid | BOARD LEVEL HEAT... |
35,000
In-stock
|
提交询价 | ||
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Aavid | BOARD LEVEL HEAT... |
35,000
In-stock
|
提交询价 | ||
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Aavid | HEAT SINK |
35,000
In-stock
|
提交询价 |