热 - 散热器
- Attachment Method：
-
- Package Cooled：
-
- Thermal Resistance @ Forced Air Flow：
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| 图片 | 型号 | 品牌 | 描述 | 库存 | 操作 | |
|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, BGA, 17 ... |
35,000
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
35,000
In-stock
|
提交询价 |
